Electronic device and method of forming the same

ABSTRACT

An electronic device is disclosed. The electronic device includes a panel, a defect in and/or on the panel and an optical film above the panel. The panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a plurality of display units disposed on the first substrate. There is a defect between the first substrate and the second substrate, or on the second substrate. In a top view of the electronic device, an optical film has a first processed area corresponding to the defect, and the first processed area at least partially overlaps at least two display units.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority of China Patent Application No.202110656860.0, filed on Jun. 11, 2021, the entirety of which isincorporated by reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to an electronic device, and inparticular to an electronic device comprising an optical film and amethod of forming the same.

Description of the Related Art

Electronic devices like display devices are widely used in electronicdevices such as mobile phones, TVs, monitors, tablet PCs, vehicleelectronic devices, wearable devices and desktop computers. With thebooming development of electronic products, the requirement for adisplay quality of an electronic device is getting higher and higher.

However, when foreign matter falls onto the electronic devices, forexample, foreign matter may fall onto an active array substrate or acolor filter substrate, or attaches itself to one of the layers betweenthe color filter substrate and the active array substrate during themanufacturing process, this may cause defects in the electronic device.These defects often result in bright spots or dark spots on theelectronic device. Therefore, the overall quality of the electronicdevice will be affected.

Therefore, providing a method of forming an electronic device that willimprove the display quality without increasing the cost is still anissue that needs to be worked on.

BRIEF SUMMARY OF THE INVENTION

The present disclosure provides an electronic device comprising anoptical film and a method of forming the same, which can improve thedisplay quality of the electronic device.

Some embodiments of the present disclosure provide an electronic devicecomprising a panel and an optical film disposed on the plane. The panelcomprises a first substrate, a second substrate disposed opposite to thefirst substrate, and a plurality of display units disposed on the firstsubstrate. A defect is between the first substrate and the secondsubstrate or on the second substrate. The optical film has a firstprocessed area corresponding to the defect. The first processed area atleast partially overlaps at least two display units. The light emittedby the display units may be the same color or different colors.

Some embodiments of the present disclosure provide a method of formingan electronic device comprising: providing a panel; providing an opticalfilm on the panel; confirming whether or not there is a defect in or onthe panel, and locating the position of the defect (defect position);and forming a first processed area that corresponds to the defectposition in the optical film.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 illustrates an exploded view of an example of an electronicdevice of the present disclosure.

FIG. 2 illustrates a top view of an example of an electronic device ofthe present disclosure.

FIG. 3 illustrates a cross-sectional schematic view of an example of anelectronic device of the present disclosure.

FIG. 4 illustrates an enlarged cross-sectional schematic view of anexample of an optical film of the present disclosure.

FIG. 5 illustrates a top view of another example of the electronicdevice of the present disclosure.

FIG. 6 illustrates a cross-sectional schematic view of an example of theelectronic device shown in FIG. 5 .

FIG. 7 illustrates a cross-sectional schematic view of another exampleof the electronic device shown in FIG. 5 .

FIG. 8 illustrates a cross-sectional schematic view of a still anotherexample of the electronic device shown in FIG. 5 .

FIG. 9 illustrates an enlarged cross-sectional schematic view of anexample of a second optical film of the present disclosure.

FIG. 10 illustrates a top view of another example of the electronicdevice of the present disclosure.

FIG. 11 illustrates a cross-sectional schematic view of an example ofthe electronic device shown in FIG. 10 .

FIG. 12 illustrates a cross-sectional schematic view of an example ofthe electronic device shown in FIG. 10 .

FIG. 13 illustrates a flow chart of an example of a method of forming anelectronic device of the present disclosure.

FIGS. 14-17 are cross-sectional schematic views corresponding to stepsof the method of forming the electronic device shown in FIG. 13 .

DETAILED DESCRIPTION OF THE INVENTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact.

Some embodiments of the disclosure are described. Additional operationscan be provided before, during, and/or after the stages described inthese embodiments. Some of the stages that are described can be replacedor eliminated for different embodiments. Although some embodiments arediscussed with operations performed in a particular order, theseoperations may be performed in another logical order.

Furthermore, when a component or a layer is referred to as “on” or“connected to” another component or film, the component or layer may bedirectly on or directly connected to the other component or film, orthere may be an interval component or film disposed between them.Conversely, when a component is referred to as being “directly” onanother component or film or “directly connected” to another componentor film, there is no interval component or film disposed between them.

The term “about” or “substantially” as used herein indicates that avalue or a range of numbers is described within 10%, 5%, 3%, 2%, 1%, or0.5% of the value. The value of the given quantity are approximatequantities, i.e. “about” or “substantially” may be implied withoutspecifying “about” or “substantially”. The term “range between the firstand second values” indicates a range including the first value, thesecond value and other values between them.

The electronic device of the present disclosure may include a displaydevice, an antenna device, a sensing device, a touch display electronicdevice, a curved display electronic device, or a free shape displayelectronic device, but the present disclosure is not limited there to.The electronic device maybe a bendable or flexible electronic device.The antenna device maybe, for example, a liquid crystal antenna, but notlimited there to. The antenna device may, for example, include anantenna splicing device, but is not limited thereto. It should be notedthat the electronic device can be but not limited to any combination ofthe aforementioned. In addition, a shape of the electronic device may bea rectangle, a circle, a polygon, a shape with curved edges, or othersuitable shape. The electronic device may have peripheral systems, suchas a drive system, control system, light source system, shelf system andthe likes for supporting the electronic device, antenna device or thesplicing device. Hereinafter, a display device will be used as anexample to illustrate the contents of this disclosure, but thisdisclosure is not limited thereto.

FIG. 1 illustrates an exploded view of an example of an electronicdevice 10 of the present disclosure. As shown in the FIG. 1 , theelectronic device 10 comprises a panel 100 and a first optical film 200disposed on the panel 100. The panel 100 comprises a first substrate110, scan lines 113 extending in a first direction (X direction), datalines 111 extending in a second direction (Y direction), and a secondsubstrate 120 corresponding to the first substrate 110 disposed on thescan lines 113 and the data lines 111. The first direction isperpendicular to the second direction. The first substrate 110 may be,for example, a thin film transistor array substrate, and the secondsubstrate 120 may be, for example, a color filter substrate. Accordingto some embodiments, the second substrate may be, for example, a polymersubstrate, but not limited thereto. Materials of the first substrate 110and the second substrate 120 may be the same or different. The materialsmay include but not limited to glass, quartz, sapphire, ceramic,polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET),polypropylene (PP), other suitable materials or any combination thereof.

A plurality of display units are provided on the first substrate 110. Inthe present disclosure, the display units of the electronic device aresub-pixels or pixels which display images to viewers. Each of thedisplay units has a stacked structure comprising all film layers,elements or parts for emitting light with brightness and color. For aliquid crystal display, the display units are sub-pixels, and eachdisplay unit may include relevant parts of a liquid crystal layer,relevant parts of a polarizer, relevant parts of a back light source,relevant parts of a substrate, relevant parts of a driver circuit, andrelevant parts of a color filter. For self-light emitting displays, suchas inorganic light-emitting diode displays (LEDs) and organiclight-emitting diode displays (OLEDs), the display units are sub-pixelsor pixels. Each display unit may include relevant parts of aself-emitting light source, relevant parts of light conversion layer,relevant parts of a polarizer, relevant parts of a substrate, andrelevant parts of a driver circuit. In addition, the plurality ofdisplay units may have a common film layer, a common component, or acommon part. Hereinafter, a liquid crystal display will be used as anexample to illustrate the present disclosure.

The data lines 111 are disposed on the first substrate 110 in the firstdirection and the scanning lines 113 are disposed on the first substrate110 in the second direction. The scanning lines 113 and the data lines111 are intersected with each other to define a plurality of displayunits PX on the first substrate 110, as shown in FIG. 2 . Somecomponents such as a cover plate (cover glass) or a backlight module areomitted from the electronic device 10 for the convenience ofdescription. The cover plate may be, for example, a glass or an acrylicresin, but it is not limited thereto. The cover plate may or may nothave a touch function. The backlight module may, for example, includerelevant optical films (such as light panels, light bars, light guideplates, reflectors, and brightness enhancement films). The backlightmodule may be, for example, a direct-type light module or a side-typelight module, but not limited thereto.

FIG. 2 illustrates a top view of an example of the electronic device 10of the present disclosure. As shown in FIG. 2 , the panel 100 includes adisplay area DA and a non-display area NDA surrounding the display areaDA. The display units PX defined by the scan lines 113 and the datalines 111 are located in the display area DA. The display unit PXincludes at least one thin film transistor (TFT). According to the colorof the emitted light, the display units PX may have the same or similarfeatures. The display units PX can be divided into red display unitsPXR, green display units PXG, and blue display units PXB. It should beunderstood that, unless otherwise indicated, the features describedbelow for a specific display unit PX of the electronic device 10 canalso be applied to any other display units PX of the electronic device10. For example, the features described below for the green display unitPXG can be applied to the red display unit PXR and/or the blue displayunit PXB. In addition, it should be understood that according to designrequirements, the electronic device 10 may have any appropriate numberof display units PX. In some embodiments, the red display units PXR, thegreen display units PXG, and the blue display units PXB may be arrangedalternately with each other. For example, the red display units PXR, thegreen display units PXG, and the blue display units PXB may be arrangedalternately in the first direction, as shown in FIG. 2 . In anotherembodiment, the red display units PXR, the green display units PXG, andthe blue display units PXB may be substantially arranged alternately inthe first direction, but not limited thereto.

The defect P is in the panel 100 or on a surface of the panel 100, whichmeans that the defect P may be between the first substrate 110 and thesecond substrate 120, or the defect P may be on the second substrate 120(in particular, on the surface of the second substrate 120). In thepresent disclosure, the “defect P” generally refers to elements thatshould not be present in the electronic device 10 or elements that mayreduce the display quality of the electronic device 10, such as foreignmatter, particles, and pollutants. During the manufacturing process ofthe panel 100, it could be found through inspection that the defects Pwill cause, for example but not limited to black spots, bright spots, ordark spots on the electronic device, which will affect the displayquality of the electronic device 10. FIG. 2 illustrates an embodiment inwhich a defect P is in the green display unit PXG as an example, but thedisclosure is not limited thereto. For example, the defect P may becaused by dust or particles in the process environment falling in/on thepanel 100. The panel 100 may include one, two or more defects P. Thedefects P may be located in the red display unit PXR, the blue displayunit PXB, or between the red display unit PXR and the blue display unitPXB. In alternatively, the defects P may be located in the red displayunit PXR, the blue display unit PXB, and between the red display unitPXR and the blue display unit PXB at the same time. However, the presentdisclosure is not limited thereto.

The first optical film 200 is disposed above the panel 100. Inparticular, the first optical film 200 is disposed on the panel 100 in athird direction (Z direction, a normal direction of the first substrate110) and overlaps the defects P. The first optical film 200 has a firstprocessed area PA1. FIG. 2 shows an embodiment in which the firstprocessed area PA1 is rectangle as an example, but the disclosure is notlimited thereto. The first processed area PA1 may have various shapes,including a square, a rectangle, a parallelogram, a polygon, and anirregular shape. The first optical film 200 may have a plurality offirst processed areas PA1, and the first processed areas PA1 may havedifferent shapes independently. A position of the first processed areaPA1 corresponds to the position of the defect P. The term “corresponds”as used herein indicates at least partially overlapping or completelyoverlapping in the third direction (Z direction, the normal direction ofthe first substrate 110, which may also be referred to as the top viewdirection of the electronic device). For example, a part of the firstelement overlaps a part of the second element, the first elementoverlaps a part of the second element, or the first element overlaps thesecond element completely in the third direction (Z direction). That is,the first processed area PA1 at least partially overlaps the defect P inthe third direction (Z direction). In some embodiments, the firstprocessed area PA1 overlaps the entire defect P. In this embodiment, aprojection of the defect P on the first substrate 110 is within aprojection of the first processed area PA1 on the first substrate 110.In some embodiments, the size of the defect point P is less than orequal to ⅔ of the width of the first processed area PA1. That is, “theprocessed area corresponds to the defect” indicates that the projectionof the defect P on the first substrate 110 is within ⅔ width of theprojection of the first processed area PA1 on the first substrate 110.In this embodiment, one first processed area PA1 may correspond to aplurality of defects P, but the disclosure is not limited thereto. Insome embodiments, a plurality of first processed areas PA1 maycorrespond to a plurality of defect points P. In some embodiments, thewidth of the first processed area PA1 in the first direction the widthof the display unit in the first direction (i.e., the distance betweentwo adjacent data lines 111). The first processed area PA1 correspondsto at least two of the display units PX, and the two display units mayemit light of the same color or different colors. For example, as shownin FIG. 2 and FIG. 3 , the first processed area PA1 at least partiallyoverlaps the green display unit PXG and the blue display unit PXB. Thefirst width W1 of the first processed area PA1≥a second width W2 of thegreen display unit PXG. In some embodiments, the first processed areaPA1 at least partially overlaps at least two display units of theplurality of display units PX, and the color of the light of the twodisplay units may be the same. It is possible to reduce the brightnessof bright spots caused by the defects P in the electronic device bydisposing the processed area corresponding to the defect P in theoptical film. Therefore, the display quality of the electronic devicecould be improved.

Referring to FIG. 3 , the defect P is on the second substrate 120 of thepanel 100, and the first optical film 200 is formed on the panel 100 andoverlaps the defect P. The first optical film 200 includes a firstprocessed area PA1, and in the top view of the electronic device 10, thefirst processed area PA1 corresponds to the defect P. The panel 100includes a first substrate 110, a plurality of thin film transistors 130disposed on the first substrate 110, an insulating layer 140 disposed onthe plurality of thin film transistors 130, an electrode layer 150disposed on the insulating layer 140, an alignment layer 180-1 disposedon the electrode layer 150, a display medium layer 170 disposed on thealignment layer 180-1, an alignment layer 180-2 disposed on the displaymedium layer 170, a color filter layer 160 disposed on the alignmentlayer 180-2, and a second substrate 120 on the color filter layer 160.Although FIG. 3 shows an embodiment in which the defect P is on thesecond substrate 120 as an example, the disclosure is not limitedthereto. In some embodiments, the defect P may be in the panel 100,including but not limited to in the display medium layer 170, in theelectrode layer 150, and/or in the insulating layer 140. In particular,the electrode layer as used herein may include, for example, a metal ora metal oxide, but it is not limited thereto. The alignment layer mayinclude, for example but not limited to a polyimide (PI). In addition,the insulating layer may be, for example but not limited to an organicinsulating layer or an inorganic insulating layer.

The optical film of the present disclosure will be further describedbelow with reference to FIG. 4 . FIG. 4 illustrates an enlargedcross-sectional schematic view of an example of a first optical film 200of the present disclosure. As shown in FIG. 4 , the first optical film200 includes a first base 210, a polarizing film 230 formed on the firstbase 210, a second base 250 formed on the polarizing film 230, and aprotective layer 270 formed on the second base 250. The first opticalfilm 200 may adhere to the second substrate 120 through the first base210. In some embodiments, the protective layer 270 may be omitted. Insome embodiments, the first base 210 may include one or more layers andthe second base 250 may include one or more layers. For example, thefirst base 210 may include a transparent waterproof base layer, anoptical compensation layer and/or an adhesive layer. The second base 250may include a transparent waterproof base layer, a polymer layer (suchas a View Angle Enhance (VAE) layer or an anti-glare layer). In someembodiments, the polymer layer may have a microstructure. FIG. 4 showsan embodiment in which the first processed area PA1 is in the secondbase 250 as an example, but the disclosure is not limited thereto. Thefirst processed area PA1 may be in one or more layers above thepolarizing film 230. The expression “the first processed area PA1 abovethe polarizing film 230” as used herein indicates that in the thirddirection, the vertical distance between the first processed area PA1and the panel 100 is greater than the vertical distance between thepolarizing film 230 and the panel 100. The optical film may include, forexample but not limited to, vinyl acetate-ethylene copolymer,polyethylene terephthalate or other suitable materials.

In some embodiments, the electronic device may further include a secondprocessed area PA2 corresponding to the defect P and overlapping theentire defect P in the third direction, as shown in FIG. 5 . FIG. 5illustrates a top view of another example of the electronic device 20 ofthe present disclosure. FIG. 5 shows an embodiment in which the shapesof the first processed area PA1 and the second processed area PA2 arerectangles as an example, but the disclosure is not limited thereto.There are several possible shapes for the first processed area PA1 andthe second processed area PA2, including square, rectangular, aparallelogram, a polygon, or an irregular shape. In the embodiment shownin FIG. 5 , the first processed area PA1 and the second processed areaPA2 correspond to the green display unit PXG and the blue display unitPXB, and they overlap a part of the green display unit PXG and the bluedisplay unit PXB in the third direction, but the disclosure is notlimited thereto. In some embodiments, the second processed area PA2 maybe located in one display unit. In the embodiment shown in FIG. 5 , thefirst processed area PA1 overlaps the entire second processed area PA2in the third direction. A projection of the defect P on the firstsubstrate 310 is within a projection of the second processed area PA2 onthe first substrate 310. The projection of the second processed area PA2on the first substrate 310 (see FIGS. 6 to 8 ) is within the projectionof the first processed area PA1 on the first substrate 310, but thedisclosure is not limited thereto. In some embodiments, one secondprocessed area PA2 may correspond to a plurality of defects P, but thedisclosure is not limited thereto. In some embodiments, a plurality ofsecond processed areas PA2 may correspond to a plurality of defectpoints P. That is, “the second processed area corresponds to the defect”indicates that the projection of the defect P on the first substrate 310is within ⅔ width of the projection of the second processed area PA2 onthe first substrate 310. In some embodiments, the first processed areaPA1 corresponds to the second processed area PA2 and partially overlapsthe second processed area PA2 in the third direction. The secondprocessed area PA2 may have a third width W3 in the first direction. Thefirst width W1 of the first processed area PA1 is greater than the thirdwidth W3 of the second processed area PA2, as shown in FIGS. 6 to 8 .

FIG. 6 illustrates a cross-sectional schematic view of an example of theelectronic device 20 shown in FIG. 5 . As shown in FIG. 6 , theelectronic device 20 includes a panel 300 and a first optical film 200as shown in FIG. 4 . The panel 300 includes a first substrate 310, aplurality of thin film transistors 330 disposed on the first substrate310, an insulating layer 340 disposed on the plurality of thin filmtransistors 330, an electrode layer 350 including a second processedarea PA2 disposed on the insulating layer 340, an alignment layer 380-1disposed on the electrode layer 350, a display medium layer 370 disposedon the alignment layer 380-1, an alignment layer 380-2 disposed on thedisplay medium layer 370, a color filter layer 360 disposed on thealignment layer 380-2, and a second substrate 320 on the color filterlayer 360. The defect P is located in the display medium layer 370. Thesecond processed area PA2 corresponds to the first processed area PA1 inthe second base 250 of the first optical film 200 as shown in FIG. 4 andthe defect P in the display medium layer 370.

FIG. 7 illustrates a cross-sectional schematic view of another exampleof the electronic device 20 shown in FIG. 5 . As shown in FIG. 7 , theelectronic device 20 includes a panel 300 and a first optical film 200as shown in FIG. 4 . The panel 300 includes a first substrate 310, aplurality of thin film transistors 330 disposed on the first substrate310, an insulating layer 340 disposed on the plurality of thin filmtransistors 330, an electrode layer 350 disposed on the insulating layer340, an alignment layer 380-1 disposed on the electrode layer 350, andisplay medium layer 370 disposed on the alignment layer 380-1, analignment layer 380-2 disposed on the display medium layer 370, a colorfilter layer 360 including a second processed area PA2 disposed on thealignment layer 380-2, and a second substrate 320 on the color filterlayer 360. The defect point P is located in the display medium layer370. The second processed area PA2 corresponds to the first processedarea PA1 in the second base 250 of the first optical film 200 as shownin FIG. 4 and the defect P in the display medium layer 370.

FIG. 8 illustrates a cross-sectional schematic view of a still anotherexample of the electronic device 20 shown in FIG. 5 . As shown in FIG. 8, the electronic device 20 includes a panel 300 and a first optical film200 as shown in FIG. 4 . The panel 300 includes a first substrate 310, aplurality of thin film transistors 330 disposed on the first substrate310, an insulating layer 340 disposed on the plurality of thin filmtransistors 330, an electrode layer 350 disposed on the insulating layer340, an alignment layer 380-1 disposed on the electrode layer 350, andisplay medium layer 370 disposed on the alignment layer 380-1, analignment layer 380-2 including a second processed area PA2 disposed onthe display medium layer 370, a color filter layer 360 disposed on thealignment layer 380-2, and a second substrate 320 on the color filterlayer 360. The defect point P is located in the display medium layer370. The second processed area PA2 corresponds to the first processedarea PA1 in the second base 250 of the first optical film 200 as shownin FIG. 4 and the defect P in the display medium layer 370.

In some embodiments, the electronic device may further include a secondoptical film 400. The second optical film 400 may include a thirdprocessed area PA3 corresponding to the defect P and overlapping theentire defect P in the third direction. The second optical film 400 ofthe present disclosure will be further described below with reference toFIG. 9 . FIG. 9 illustrates an enlarged cross-sectional schematic viewof an example of a second optical film 400 of the present disclosure. Asshown in FIG. 9 , the second optical film 400 includes a first base 410,a polarizing film 430 formed on the first base 410, a second base 450formed on the polarizing film 430, and a protective layer 470 formed onthe second base 450. The second optical film 400 may adhere to the firstsubstrate of the panel through the first base 410. In some embodiments,the protective layer 470 may be omitted. In some embodiments, the firstbase 410 may include one or more layers and the second base 450 mayinclude one or more layers. For example, the first base 410 may includea transparent waterproof base layer, an optical compensation layer,and/or an adhesive layer. The second base 450 may include a transparentwaterproof base layer, a polymer layer, and/or an anti-glare layer. FIG.9 shows an embodiment in which the third processed area PA3 is in thesecond substrate 450 as an example, but the disclosure is not limitedthereto. The third processed area PA3 may be located in one or morelayers of the second base 450 above the polarizing film 430. Theexpression “the third processed area PA3 above the polarizing film 430”as used herein indicates that in the third direction, the verticaldistance between the third processed area PA3 and the panel is greaterthan the vertical distance between the polarizing film 430 and thepanel.

The structure of the second optical film 400 and the materials of eachlayer included in the second optical film 400 may be the same as ordifferent from the first optical film 200. For example, in oneembodiment, the first optical film 200 includes a first base 210, apolarizing film 230, a second base 250, and a protective layer 270. Thesecond optical film 400 includes a first base 410 and a polarizing film430 and a second base 450.

FIG. 10 illustrates a top view of another example of the electronicdevice 30 including the second optical film 400 of the presentdisclosure. FIG. 10 shows an embodiment in which the shapes of the firstprocessed area PA1, the second processed area PA2, and the thirdprocessed area PA3 are all rectangles as an example, but the disclosureis not limited thereto. There are a number of possible shapes for thefirst processed area PA1, the second processed area PA2, and the thirdprocessed area PA3, including square, rectangular, a parallelogram, apolygon, or some irregular shape. In the embodiment shown in FIG. 10 ,the first processed area PA1 and the second processed area PA2correspond to the green display unit PXG and the blue display unit PXB,and they overlap a part of the green display unit PXG and the bluedisplay unit PXB in the third direction. The third processed area PA3corresponds to the green display unit PXG, and it overlaps a part of thegreen display unit PXG in the third direction, but the disclosure is notlimited thereto. In some embodiments, the second processed area PA2 maybe located in one display unit, and the third processed area PA3 maycorrespond to two display units. In the embodiment shown in FIG. 10 ,the first processed area PA1 overlaps the entire second processed areaPA2 in the third direction, and the second processed area PA2 overlapsthe entire third processed area PA3 in the third direction. A projectionof the defect P on the first substrate 510 is within a projection of thethird processed area PA3 on the first substrate 510. The projection ofthe third processed area PA3 on the first substrate 510 is within theprojection of the second processed area PA2 on the first substrate 510.The projection of the second processed area PA2 on the first substrate510 (see FIGS. 11 and 12 ) is within the projection of the firstprocessed area PA1 on the first substrate 510, but the disclosure is notlimited thereto. In some embodiments, one third processed area PA3 maycorrespond to a plurality of defects P, but the disclosure is notlimited thereto. In some embodiments, a plurality of third processedarea PA3 may correspond to a plurality of defect points P. That is, “thethird processed area corresponds to the defect” indicates that aprojection of the defect P on the first substrate 510 is within ⅔ widthof a projection of the third processed area PA3 on the first substrate510. In some embodiments, the first processed area PA1 may partiallyoverlap the second processed area PA2 in the third direction, the firstprocessed area PA1 may partially overlap the third processed area PA3 inthe third direction, and/or the second processed area PA2 may partiallyoverlap the third processed area PA3 in the third direction. The thirdprocessed area PA3 may have a fifth width W5 in the first direction. Thefirst width W1 of the first processed area PA1 is greater than the thirdwidth W3 of the second processed area PA2, and the third width W3 of thesecond processed area PA2 is greater than the fifth width W5 of thethird processed area PA3 as shown in FIGS. 11 and 12 , but it is notlimited thereto. In some embodiments, the third width W3 of the secondprocessed area PA2 is smaller than the fifth width W5 of the thirdprocessed area PA3.

FIG. 11 illustrates a cross-sectional schematic view of an example ofthe electronic device 30 shown in FIG. 10 . As shown in FIG. 11 , theelectronic device 30 includes the first optical film 200 shown in FIG. 4, the second optical film 400 shown in FIG. 10 , and a panel 500 betweenthe first optical film 200 and the second optical film 400. The panel500 includes a first substrate 510, a plurality of thin film transistors530 disposed on the first substrate 510, an insulating layer 540disposed on the plurality of thin film transistors 530, an electrodelayer 550 including a second processed area PA2 disposed on theinsulating layer 540, an alignment layer 580-1 disposed on the electrodelayer 550, a display medium layer 570 disposed on the alignment layer580-1, an alignment layer 580-2 disposed on the display medium layer570, a color filter layer 560 disposed on the alignment layer 580-2 anda second substrate 520 on the color filter layer 560. The defect P islocated in the display medium layer 570. The second processed area PA2is in the electrode layer 550 and corresponds to the first processedarea PA1 in the second base 250 of the first optical film 200 shown inFIG. 4 , the third processed area PA3 in the second base 450 of thesecond optical film 400 shown in FIG. 9 , and the defect P.

FIG. 12 illustrates a cross-sectional schematic view of an example ofthe electronic device 30 shown in FIG. 10 . As shown in FIG. 12 , theelectronic device 30 includes the first optical film 200 shown in FIG. 4, the second optical film 400 shown in FIG. 10 , and a panel 500 betweenthe first optical film 200 and the second optical film 400. The panel500 includes a first substrate 510, a plurality of thin film transistors530 disposed on the first substrate 510, an insulating layer 540disposed on the plurality of thin film transistors 530, an electrodelayer 550 disposed on the insulating layer 540, an alignment layer 580-1disposed on the electrode layer 550, a display medium layer 570 disposedon the alignment layer 580-1, an alignment layer 580-2 disposed on thedisplay medium layer 570, a color filter layer 560 including a secondprocessed area PA2 disposed on the alignment layer 580-2 and a secondsubstrate 520 on the color filter layer 560. The defect P is located inthe display medium layer 570. The second processed area PA2 is in thecolor filter layer 560 and corresponds to the first processed area PA1in the second base 250 of the first optical film 200 shown in FIG. 4 ,the third processed area PA3 in the second base 450 of the secondoptical film 400 shown in FIG. 9 , and the defect P.

The present disclosure also provides a method of forming an electronicdevice. FIG. 13 illustrates a flow chart of an example of method 40 offorming an electronic device of the present disclosure. As shown in FIG.13 , the method 40 of forming an electronic device of the presentdisclosure comprises the following steps. Step S401 provides a panel.Step S403 provides an optical film on the panel. Step S405 confirmswhether there is a defect in or on the panel, and locates the defect'sposition. Step S407 forms a first processed area that corresponds to theposition of the defect in the optical film.

Hereinafter, the method 40 for forming the electronic device of thepresent disclosure will be described with reference to FIGS. 14 to 17 .FIGS. 14-17 are cross-sectional schematic views corresponding to eachstep of the forming method of an electronic device shown in FIG. 13 .

First, the panel 700 shown in FIG. 14 is provided in step S401. Thepanel 700 includes a plurality of display units PX, and the displayunits PX can be divided into red display units PXR, green display unitsPXG, and blue display units PXB according to the color of the emittedlight. The panel 700 includes a first substrate 710 and a secondsubstrate 720. FIG. 14 shows an embodiment in which the first substrate710 is a thin film transistor substrate, the second substrate 720 is acolor filter substrate, and the defect P is located between the firstsubstrate 710 and the second substrate 720 as an example. In thisembodiment, the distance between the second substrate 720 and the defectP is greater than the distance between the first substrate 710 and thedefect P, but the disclosure is not limited thereto. FIG. 14 shows onlyone defect P as an example, but the disclosure is not limited thereto.In some embodiments, the panel provided in step S401 may be a panelwithout defects P. In some embodiments, the panel provided in step S401may include a plurality of defects. The plurality of defects may belocated at various positions of the panel 700. For example, the defectmay be formed on the surface of the first substrate 710 and/or thesecond substrate 720 of the panel 700, in or between layers between thefirst substrate 710 and the second substrate 720.

Next, in step S403, the optical film 600 is formed in a light emittingdirection of the panel 700, as shown in FIG. 15 . In some embodiments,the optical film 600 may be attached on the panel 700. The optical film600 may have a multilayer structure. For example, as shown in FIG. 15 ,the optical film 600 may include a first base 610, a polarizing film 630disposed on the first base 610, a second base 650 disposed on thepolarizing film 630, and a protective layer 670 on the second base 650,but the disclosure is not limited thereto. In some embodiments, theprotective layer 670 may be omitted. The first base 610 and the secondbase 650 may independently have a single-layer or multi-layer structure.In some embodiments, the first base 610 and the second base 650 mayinclude a waterproof transparent substrate, so as to prevent thepolarizing film from external moisture. In some embodiments, the firstbase 610 may be a multilayer structure including a transparent substrateand an adhesive layer. In this embodiment, the optical film 600 mayadhere to the panel 700 through the adhesive layer. FIG. 15 shows thatthe second base 650 includes a transparent waterproof base layer 651, ananti-glare layer 655, and a polymer layer 653 disposed between thetransparent waterproof base layer 651 and the anti-glare layer 655,wherein the polymer layer 653 has a microstructure as an example, butthe present disclosure is not limited thereto. In some embodiments, thepolymer layer 653 may not have a microstructure. In some embodiments,the anti-glare layer 655 may be omitted.

In step S405, the structure obtained in step S403 is inspected with anoptical microscope (OM) and/or a scanning electron microscope (SEM) tofind the defect P, and the position of the defect P is marked as the“defect position.” The defect P as used herein may be a defect that wasoriginally present in the panel, or it may be a defect caused by dust orother particles on the panel. Defects P will cause bright spots in theelectronic device when the defect P is between the layers of theelectronic device. Accordingly, the defect position may be located byfinding an area within the electronic device that corresponds to themulti-layer stacked structure in which the defect P is present. It maybe observed in the Z direction (the normal direction of the substrate)through the optical microscope that the brightness of the area where thedefect P is present is brighter than other areas in the electronicdevice while the backlight module of the electronic device is turned on.The difference in brightness of light emitted by the electronic devicecould be inspected by, for example, the human eye, or a suitableinstrument. However, the method of locating the defect position is notlimited thereto.

After the defect position is located, a first processed area PA1 isformed in the area of the optical film 600 that corresponds to thedefect position using a frosting process in step S407. The resultingstructure is shown in FIG. 16 . The frosting process includes usingnanosecond laser technology, picosecond laser technology, femtosecondlaser technology, or a combination thereof. The first processed area PA1corresponding to the defect P is formed by irradiating the area of theoptical film 600 corresponding to the defect position with a nanosecondlaser, a picosecond laser, a femtosecond laser, or a combinationthereof. For example, the picosecond laser and the femtosecond lasercould destroy and frost a target area without destroying a structureabove the target area. The laser technology described in the presentdisclosure may use, for example but not limited to 355 nm, 533 nm, or1064 nm laser light or a combination thereof. The frosting process ofstep S407 will be further described below with reference to FIG. 16 .FIG. 16 illustrates an embodiment in which the first processed area PA1is formed in the polymer layer 653 with a microstructure as an example,but the present disclosure is not limited thereto. In some embodiments,the first processed area PA1 may be formed in the transparent waterproofbase layer 651/or the anti-glare layer 655, as long as the verticaldistance between the first processed area PA1 and the panel 700 isgreater than the vertical distance between the polarizing film 630 andthe panel 700. In this embodiment, a focus of the laser (for example, a533 nm picosecond/femtosecond laser pulse, a 1064 nmpicosecond/femtosecond laser pulse or a combination thereof) is adjustedto irradiate the area of the polymer layer 653 corresponding to thedefect position. Thereby, the microstructure of the area is destroyedand the area is frosted to form the first processed area PA1. A lightpassing through the first processed area PA1 may be scatterednon-uniformly because the microstructure of the polymer layer 653 hasbeen destroyed. Part of the light passing through the first processedarea PA1 can be absorbed by the first processed area PA1 because themicrostructure of the polymer layer 653 has been frosted. That is, thecontinuous microstructure of the polymer layer 653 is destroyed byfrosting the area corresponding to the defect P with the frostingprocess. Therefore, the light reflected by the defect P will bescattered while passing through the processing area PA1. Accordingly, byforming the first processed area PA1 corresponding to the defect P, thebrightness of the bright spot caused by the defect P could be reduced.The first processed area PA1 may have various shapes, including asquare, a rectangle, a parallelogram, a polygon, and an irregular shape.In general, considering the traveling direction and scatteringcharacteristics of light, the width of the first processed area PA1 inthe first direction (X direction) needs to be greater than or equal tothe width of at least one display unit in the first direction to ensurethat the defect P is fully covered. In some embodiments, the size of thedefect P is less than or equal to ⅔ of the width of the first processedarea PA1. Therefore, one first processed area PA1 may correspond to oneor more defects.

In some embodiments, the first processed area PA1 corresponds to twoadjacent display units that emit lights with different colors. In someembodiments, the first processed area PA1 at least partially overlapsthe at least two display units, wherein the light emitted by the atleast two display units has the same or different colors.

In some embodiments, the method 40 of forming an electronic device mayfurther include a step S406 for forming a second processed area PA2 inthe panel corresponding to the defect position before step S407. Thesecond processed area PA2 is formed by a carbonization process. Thecarbonization process includes irradiating the panel with nanosecondlaser, picosecond laser, femtosecond laser, or a combination thereof toform the second processed area PA2. For example, the picosecond laserand femtosecond laser technology used in the carbonization process candestroy and carbonize the target area without destroying a structureabove the target area. The carbonization process of step S406 will befurther described below with reference to FIG. 17 . Although FIG. 17shows an embodiment in which the second processed area PA2 is formed inthe first substrate 710 (the color filter layer substrate of thisembodiment) as an example, the present disclosure is not limitedthereto. In some embodiments, the second processed area PA2 may beformed in the second substrate 720 (the thin film transistor substrateof this embodiment). In this embodiment, after locating the defectposition, a focus of the laser (for example, a 533 nmpicosecond/femtosecond laser pulse, a 1064 nm picosecond/femtosecondlaser pulse or a combination thereof) is adjusted to irradiate an areaof the first substrate 710 corresponding to the defect position.Thereby, the area is carbonized to form the second processed area PA2.In one embodiment, after the second processed area PA2 is formed, thefocus of the laser pulse could be adjusted to form the first processedarea PA1 corresponding to the second processed area PA2 in step S407.

Similar to the first processed area PA1, the second processed area PA2may have various shapes, including squares, rectangles, parallelograms,polygons, and irregular shapes. In general, considering the travelingdirection and scattering characteristics of light, the width of thefirst processed area PA1 (farther from the defect P than the secondprocessed area PA2) in the first direction needs to be greater than orequal to the second processed area PA2 (closer to the defect P than thefirst processed area PA1) in the first direction to ensure that thedefect P is fully covered. The brightness of the bright spot caused bythe defect P could be reduced, but is not limited thereto. Similar tothe first processed area PA1, one second processed area PA2 maycorrespond to one or more defects.

In some embodiments, the carbon content of the layer comprising thefirst processed area PA1 (for example, the polymer layer 653) may belower than that of the layer comprising the second processed area PA2(for example, the electrode layer in the first substrate 710 or thecolor filter layer or the alignment layer in the second substrate 710).In some embodiments, when the first processed area PA1 is in the opticalfilm, the area of the upper surface of the optical film corresponding tothe first processed area PA1 may have a protruding structure. Therefore,when the optical film has a protective layer 670 as the outermost layer,the area of an upper surface of the protective layer 670 correspondingto the first processed area PA1 may have a protruding structure due tothe first processed area PA1 of the optical film, but it is not limitedthereto. The “outermost layer” as used herein indicates a layer which isfarthest away from the panel.

In some embodiments, before step S405, the method 40 of forming anelectronic device may further include forming a second optical film onthe panel. Therefore, the panel 700 is disposed between the optical film600 and the second optical film. The second optical film may have astructure similar to that of the optical film 600. In this embodiment,the second optical film may include a polarizing film and a thirdprocessed area. The third processed area can be formed in the secondoptical film by the same process as forming the first processed area PA1after step S405. Therefore, a light transmittance of the third processedarea may be the same as that of the first processed area PA1. The lighttransmittance of the third processed area may be greater than a lighttransmittance of the second processed area PA2. The third processed areamay be formed before the second processed area PA2 or after the firstprocessed area PA1 Similar to the first processed area PA1, the verticaldistance between the third processed area in the second optical film andthe panel 700 is greater than the vertical distance between thepolarizing film in the second optical film and the panel 700. Thebrightness of the bright spot caused by the defect P can be furtherreduced by forming the third processed area.

The present disclosure provides a method for forming an electronicdevice that reduces the brightness of the bright spot caused by thedefect P. By reducing the brightness of the bright spots caused by thedefect P, the defective panel can be repaired. Therefore, the displayquality of the electronic device including the defective panel could beimproved. In summary, the method provided by the present disclosure canreduce the manufacturing cost of the electronic device by processing thedefective panel.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure. The features between the embodiments can be combinedarbitrarily as long as they do not depart from or conflict with thespirit and scope of the present disclosure. In addition, each claim ofthe present disclosure may be an individual embodiment, and the scope ofthe present disclosure includes each claim of the present disclosure andany combinations of the embodiments.

While the disclosure has been disclosed by several preferredembodiments, the disclosure is not limited to the disclosed embodiments.Those skilled in the art may make various substitutions and alterationsherein without departing from the spirit and scope of the presentdisclosure, and the different embodiments may be mixed to use, which isnot limited herein. Therefore, the scope of protection of the presentdisclosure is defined as the subject matter set forth in the appendedclaims.

1. An electronic device, comprising: a panel, the panel comprising: afirst substrate; a second substrate, disposed opposite to the firstsubstrate; and a plurality of display units, disposed on the firstsubstrate, a defect, between the first substrate and the secondsubstrate or on the second substrate; and an optical film, disposed on atop surface of the panel, the optical film having a first processedarea, wherein in a top view of the electronic device, the firstprocessed area corresponds to the defect, and the first processed areaat least partially overlaps at least two display units, wherein avertical distance between a top surface of the optical film and the topsurface of the panel is greater than a vertical distance between a topsurface of the first processed area and the top surface of the panel. 2.The electronic device as claimed in claim 1, wherein the first processedarea has a first width in a first direction, one of the at least twodisplay units has a second width in the first direction, and the firstwidth is greater than or equal to the second width.
 3. The electronicdevice as claimed in claim 1, wherein one of the at least two displayunits has a second processed area, and the second processed areacorresponds to the first processed area.
 4. The electronic device asclaimed in claim 3, wherein the first processed area has a first widthin a first direction, the second processed area has a third width in thefirst direction, and the first width is greater than or equal to thethird width.
 5. The electronic device as claimed in claim 3, wherein thepanel further comprises an electrode layer on the first substrate, andthe second processed area is in the electrode layer.
 6. The electronicdevice as claimed in claim 3, wherein the panel further comprises acolor filter layer on the first substrate, and the second processed areais in the color filter layer.
 7. The electronic device as claimed inclaim 3, wherein the panel further includes an alignment layer on thefirst substrate, and the second processed area is in the alignmentlayer.
 8. A method of forming an electronic device, comprising:providing a panel; providing an optical film on a top surface of thepanel; confirming whether or not there is a defect in or on the panel,and locating the position of the defect as a defect position; andforming a first processed area that corresponds to the defect positionin the optical wherein a vertical distance between a top surface of theoptical film and the top surface of the panel is greater than a verticaldistance between a top surface of the first processed area and the topsurface of the panel.
 9. The method as claimed in claim 8, wherein theoptical film comprises a first base, a second base, and a polarizingfilm between the first base and the second base, wherein the firstprocessed area is in the first base, and a vertical distance between thefirst processed area and the panel is greater than a vertical distancebetween the polarizing film and the panel.
 10. The method as claimed inclaim 8, further comprising forming a second processed area thatcorresponds to the defect position in the panel before forming the firstprocessed area.